Waferlevel Vacuum Packaged Microscanners: A High Yield Fabrication Process for Mobile Applications
نویسندگان
چکیده
منابع مشابه
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* School of Electrical Engineering and Computer Sciences, ASRI, ISRC, Seoul National University, Seoul, Korea (e-mail: [email protected]) SML Electronics, Inc., Seoul, Korea (e-mail: [email protected]) *** School of Electrical Engineering and Computer Sciences, ASRI, ISRC, Seoul National University, Seoul, Korea (e-mail: [email protected]) **** School of Electrical Engineering and Compu...
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ژورنال
عنوان ژورنال: Journal of Integrated Circuits and Systems
سال: 2009
ISSN: 1872-0234,1807-1953
DOI: 10.29292/jics.v4i2.301